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DEEPX press kit materials laid out on a dark surface: a Press Kit box, an Edge AI Semiconductor brochure, a DEEPX NPU chip, a module board and a branded USB drive.Notice

The DEEPX Newsroom is now open

DEEPX press releases, media coverage, insights, events and corporate notices now live in one newsroom, with press contacts and email updates alongside.

Press release

DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Physical AI Compute Platform for Robotics

DEEPX and Hyundai Motor Group Robotics LAB partner to co-develop a Physical AI computing platform for robotics, enabling real-time large-scale generative AI

Press release

DEEPX Targets the European Market at ‘Embedded World 2026’, Building a Comprehensive Alliance with 10 Global Partners

DEEPX showcases physical AI technology at Embedded World 2026 in Germany with 10 global partners including Renesas and Raspberry Pi, unveiling mass-produced

Press release

CES 2026 Foundry: DEEPX Declares the Era of Physical AI with Global Partners

DEEPX hosted a CES 2026 panel with global partners including Hyundai, Baidu, and Ultralytics to discuss Physical AI infrastructure, emphasizing the shift of AI

Press release

CES 2026 Media Briefing: DEEPX Unveils Physical AI Vision & Roadmap

DEEPX unveiled its DX-M2 AI processor at CES 2026, enabling 20B–100B parameter LLMs to run on-device at under 5 watts, shifting generative AI from cloud

CESPress release

DEEPX: CTA’s “What Not To Miss” for 2nd Year at CES 2026

DEEPX, an ultra-low-power AI semiconductor company, was selected for CTA's "What Not To Miss" guide at CES 2026 for the second consecutive year, showcasing its