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DEEPX press kit materials laid out on a dark surface: a Press Kit box, an Edge AI Semiconductor brochure, a DEEPX NPU chip, a module board and a branded USB drive.Notice

The DEEPX Newsroom is now open

DEEPX press releases, media coverage, insights, events and corporate notices now live in one newsroom, with press contacts and email updates alongside.
Text swirling around a mouthPress release

DX-M1 now runs SLMs fully on-device.

DX-M1 chip now supports on-device Small Language Models, enabling real-time voice responses alongside vision capabilities without internet connectivity or
Press release

DEEPX Announces Global Physical AI Mass Production Partnership with AAEON

DEEPX and AAEON signed a three-year mass production partnership to integrate DEEPX's AI semiconductors into AAEON's industrial computers, single-board
Press release

[Notice] Warning Regarding Impersonation and Copyright Infringement in Vietnam

A Vietnamese entity named DEEPX SOLUTIONS JSC is impersonating DEEPX and illegally using the company's NPU product photos and CEO presentation images on
YoloPress release

DEEPX and Ultralytics Forge Strategic Alliance to Define the Global Standard for Physical AI in the YOLO Community

DEEPX and Ultralytics partner to integrate DEEPX's NPU hardware into the Ultralytics YOLO ecosystem, enabling developers to deploy computer vision models to
Press release

DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Physical AI Compute Platform for Robotics

DEEPX and Hyundai Motor Group Robotics LAB partner to co-develop a Physical AI computing platform for robotics, enabling real-time large-scale generative AI
Press release

DEEPX Targets the European Market at ‘Embedded World 2026’, Building a Comprehensive Alliance with 10 Global Partners

DEEPX showcases physical AI technology at Embedded World 2026 in Germany with 10 global partners including Renesas and Raspberry Pi, unveiling mass-produced
Press release

CES 2026 Foundry: DEEPX Declares the Era of Physical AI with Global Partners

DEEPX hosted a CES 2026 panel with global partners including Hyundai, Baidu, and Ultralytics to discuss Physical AI infrastructure, emphasizing the shift of AI
Press release

CES 2026 Media Briefing: DEEPX Unveils Physical AI Vision & Roadmap

DEEPX unveiled its DX-M2 AI processor at CES 2026, enabling 20B–100B parameter LLMs to run on-device at under 5 watts, shifting generative AI from cloud
CESPress release

DEEPX: CTA’s “What Not To Miss” for 2nd Year at CES 2026

DEEPX, an ultra-low-power AI semiconductor company, was selected for CTA's "What Not To Miss" guide at CES 2026 for the second consecutive year, showcasing its
(Photo 1) DEEPX exhibition booth at CES 2025, held in Las Vegas, January 2025Press release

DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026

DEEPX positions itself as a "Physical AI Infrastructure Company" at CES 2026, unveiling its 2nm DX-M2 chip and Open-Source Physical AI Alliance with partners
Press release

DEEPX Signs Strategic Partnership with Avnet Silica, Accelerating Expansion into theEMEA

DEEPX partners with Avnet Silica to distribute ultra-low-power AI semiconductors across EMEA, targeting smart cities, robotics, and industrial applications